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	Carbon Nanotubes Based Composites with High Dielectric Constant and Low Loss
	Imtiaz Madni; Shuhui Yu; Rong Sun
	2012
会议名称	Electronic Materials and Packaging (EMAP), 2012 14th International Conference on
会议地点	香港
英文摘要	Recently, an extraordinary increase has been found in dielectric constant of the composites containing electrical conducting granules. Multiwalled carbon nanotubes (MWNTs) are selected as the conducting filler due to their large aspect ratio and unique physical properties, in particular electrical and mechanical. In this research, the dielectric properties of the functionalized multiwalled carbon nanotubes/BaTiO3/Polymer composites are studied. Ball-milling equipment was used to fabricate mechanically treated composite fillers which were composed of BaTiO3 nanoparticles and MWNTs. The hybrid films fabricated by incorporating these composite fillers in a Bismaleimide-triazine matrix had a high dielectric constant (Dk) above 50 and a significantly low loss, less than 0.02 at 10 Wt. % filler loading. However, the ratio of CNT to BaTiO3 was very low, i.e. 1:10 MWNTs to BaTiO3 content. We studied the effect of various loading ratios of MWNTs to BaTiO3, which led to find out the percolation threshold in the hybrid film. Characteristics including material components, dielectric constant and loss, and topography at dielectric interfaces are compared. The effects of ball milling were investigated. The experimental results suggest that the dielectric properties of the hybrid films containing MWNT/BaTiO3 as fillers can be improved significantly by tailoring the ratio of CNT to BaTiO3 and refining the ball-milling process. This novel hybrid film composed of the composite filler and Bismaleimide-triazine (BT resin) matrix can be used as embedded capacitor material.
收录类别	EI
语种	英语
内容类型	会议论文
源URL	[http://ir.siat.ac.cn:8080/handle/172644/3864]
专题	深圳先进技术研究院_集成所
作者单位	2012
推荐引用方式 GB/T 7714	Imtiaz Madni,Shuhui Yu,Rong Sun. Carbon Nanotubes Based Composites with High Dielectric Constant and Low Loss[C]. 见:Electronic Materials and Packaging (EMAP), 2012 14th International Conference on. 香港.

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