Pre-annealing induced oxide barrier to suppress the overselenization of Mo contact
Li W(李文)1,3; Han XX(韩修训)1,2; Zhao Y(赵雲)1; Yang SR(杨生荣)2
刊名Journal of Materials Science: Materials in Electronics
2016
卷号27期号:11页码:11188-11191
ISSN号0957-4522
通讯作者韩修训 ; 杨生荣
英文摘要

Molybdenum (Mo) is commonly used as the back contact material complying well with the formation of an ohmic contact for chalcogenide thin film solar cells. However, the easy formation of an over-thick MoSe2 layer between the Cu2ZnSn(S,Se)4 absorber and Mo back contact significantly deteriorates the device performance. To overcome the degradation, the effects of thermal treatment on Mo layers have been investigated in this paper. It was found that pre-annealing Mo back contacts is effective to control the growth of interfacial MoSe2 layer during selenization. Moreover, the thickness of MoSe2 layer could be conveniently tailored by simply varying the pre-annealing temperature. The work provides direct proof that the appearance of a thin MoO2 layer on the top of annealed Mo film indeed acts as a temporary barrier to block the over-selenization of Mo back contact.

学科主题材料科学与物理化学
收录类别SCI
资助信息the ‘‘Top Hundred Talents Program’’ of Chinese Academy of Sciences (CAS)
语种英语
WOS记录号WOS:000386367000009
内容类型期刊论文
源URL[http://210.77.64.217/handle/362003/20474]  
专题兰州化学物理研究所_清洁能源化学与材料实验室
兰州化学物理研究所_固体润滑国家重点实验室
作者单位1.Laboratory of Clean Energy Chemistry and Materials
2.State Key Laboratory of Solid Lubrication
3.University of Chinese Academy of Sciences
推荐引用方式
GB/T 7714
Li W,Han XX,Zhao Y,et al. Pre-annealing induced oxide barrier to suppress the overselenization of Mo contact[J]. Journal of Materials Science: Materials in Electronics,2016,27(11):11188-11191.
APA Li W,Han XX,Zhao Y,&Yang SR.(2016).Pre-annealing induced oxide barrier to suppress the overselenization of Mo contact.Journal of Materials Science: Materials in Electronics,27(11),11188-11191.
MLA Li W,et al."Pre-annealing induced oxide barrier to suppress the overselenization of Mo contact".Journal of Materials Science: Materials in Electronics 27.11(2016):11188-11191.
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