Stress measurement at the interface between a Si substrate and diamond-like carbon/Cr/W films by the electronic backscatter diffraction method

	Stress measurement at the interface between a Si substrate and diamond-like carbon/Cr/W films by the electronic backscatter diffraction method
	Zhou, Liqi ; Xu, Guofu ; Li, Xu ; Wang, Xinwei ; Ren, Lingling ; Wang, Aiying ; Tao, Xingfu
刊名	APPLIED PHYSICS EXPRESS
	2016
卷号	9 期号:2
ISSN号	1882-0778
公开日期	2016-09-18
内容类型	期刊论文
源URL	[http://ir.nimte.ac.cn/handle/174433/13110]
专题	宁波材料技术与工程研究所_2016专题
推荐引用方式 GB/T 7714	Zhou, Liqi,Xu, Guofu,Li, Xu,et al. Stress measurement at the interface between a Si substrate and diamond-like carbon/Cr/W films by the electronic backscatter diffraction method[J]. APPLIED PHYSICS EXPRESS,2016,9(2).
APA	Zhou, Liqi.,Xu, Guofu.,Li, Xu.,Wang, Xinwei.,Ren, Lingling.,...&Tao, Xingfu.(2016).Stress measurement at the interface between a Si substrate and diamond-like carbon/Cr/W films by the electronic backscatter diffraction method.APPLIED PHYSICS EXPRESS,9(2).
MLA	Zhou, Liqi,et al."Stress measurement at the interface between a Si substrate and diamond-like carbon/Cr/W films by the electronic backscatter diffraction method".APPLIED PHYSICS EXPRESS 9.2(2016).