Isothermal curing kinetics and mechanism of DGEBA epoxy resin with phthalide-containing aromatic diamine

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	Isothermal curing kinetics and mechanism of DGEBA epoxy resin with phthalide-containing aromatic diamine
	Ren, Rong ; Xiong, Xuhai ; Ma, Xinghua ; Liu, Siyang ; Wang, Jing ; Chen, Ping ; Zeng, You
刊名	THERMOCHIMICA ACTA
	2016
卷号	623 页码:15-21
关键词	Epoxy resin Aromatic diamine Curing kinetics Isothermal DSC Diffusion control
ISSN号	0040-6031
通讯作者	xiongxuhai@sau.edu.cn
收录类别	SCI
资助信息	National Natural Science Foundation of China [51303107]; Liaoning Key Laboratory Fundamental Research Project [LZ2015058]; Aerospace Science Foundation of China [2014ZF54030]; National Defense 12th Five-Year Fundamental Research Program [A352010****]; Shenyang National Laboratory for Material Science [2015RP13]
语种	英语
公开日期	2016-04-21
内容类型	期刊论文
源URL	[http://ir.imr.ac.cn/handle/321006/74935]
专题	金属研究所_中国科学院金属研究所
推荐引用方式 GB/T 7714	Ren, Rong,Xiong, Xuhai,Ma, Xinghua,et al. Isothermal curing kinetics and mechanism of DGEBA epoxy resin with phthalide-containing aromatic diamine[J]. THERMOCHIMICA ACTA,2016,623:15-21.
APA	Ren, Rong.,Xiong, Xuhai.,Ma, Xinghua.,Liu, Siyang.,Wang, Jing.,...&Zeng, You.(2016).Isothermal curing kinetics and mechanism of DGEBA epoxy resin with phthalide-containing aromatic diamine.THERMOCHIMICA ACTA,623,15-21.
MLA	Ren, Rong,et al."Isothermal curing kinetics and mechanism of DGEBA epoxy resin with phthalide-containing aromatic diamine".THERMOCHIMICA ACTA 623(2016):15-21.